Recent engineering applications require advanced models capable of analyzing structures with complex geometries under various multifield loading conditions. Furthermore, the study of coupling effects between various physical phenomena with a reduced computational cost is a crucial aspect of advanced engineering design. This contribution presents an innovative two-dimensional formulation, based on higher-order theories, for predicting the multifield response of doubly-curved laminated structures made of smart innovative materials under thermodynamic equilibrium [1]. The formulation, developed in curvilinear principal coordinates, uses a generalized description of the field variables, and considers lamination schemes where each layer is characterized by constitutive relations coupling mechanical elasticity, electrostatics, magnetostatics, thermal conduction, and moisture diffusion equations [2]. Generalized surface loads are applied to the panel either as surface fluxes or prescribed values of the configuration variables [3]. A semi-analytical Navier solution is derived, and the governing equations are implemented numerically using the Generalized Differential Quadrature (GDQ) method for mechanical elasticity problems. Primary and secondary variables are reconstructed within the three-dimensional solid through post-processing from the external loading conditions, based on the GDQ method and the Generalized Integral Quadrature (GIQ), while ensuring a high accuracy compared to three-dimensional solutions [4]. Extensive numerical examples are presented where the model is validated against finite element three-dimensional simulations. In addition, novel multifield analyses are conducted, accounting for coupling effects typically neglected in common commercial softwares, such as pyroelectric, pyromagnetic, and Dufour-Soret hygro-thermal phenomena. The results demonstrate that the multifield coupling can influence the structural response, leading to deviations from uncoupled simulations. In addition, the proposed formulation exhibits a high accuracy while significantly reducing the computational effort. In this way, new possibilities can be explored for efficient multifield analyses.